Foster-Miller is a leader in the electronics packaging market for the application of liquid crystal polymers (LCPs) as electronic substrates and packaging platforms. With a commercial supply of LCP film and laminate in place, we deliver LCP packaging solutions, including fabrication, assembly and sealing of precision lid assemblies for optoelectronic modules. We are also developing microfabrication techniques for LCPs, in line with industry needs for polymer substrates and polymer microfabrication techniques as alternates to silicon. Some significant market challenges we have met include hermeticity and sealing technology:

• An all-LCP package passed Mil Standard 882 hermetic package tests;  a package with optical fibers through an LCP sidewall of opto-electronic packages also demonstrated hermeticity.
• Optical windows were sealed into a precision lid assembly.  LCP package assemblies were sealed with solder, ultrasonics and laser technologies. (demonstrated on contract to the U.S. Army for packaging lasers used in optical interconnections for communications). 

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